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 Preliminary 2
Typical Applications * 3V CDMA/AMPS Cellular Handsets * Spread-Spectrum Systems
RF3105
3V 900MHZ LINEAR AMPLIFIER MODULE
2
POWER AMPLIFIERS
4.390 6.0 sq 0.100
Dimensions in mm.
Product Description
The RF3105 is a high-power, high-efficiency linear amplifier IC targeting 3V handheld systems. The device is manufactured on an advanced Gallium Arsenide Heterojunction Bipolar Transistor (HBT) process, and has been designed for use as the final RF amplifier in dual-mode 3V CDMA/AMPS handheld digital cellular equipment, spread-spectrum systems, and other applications in the 824MHz to 849MHz band. The RF3105 has a digital bias control voltage for low current in standby mode. The device is self-contained with 50 input and output that is matched to obtain optimum power, efficiency, and linearity characteristics. The module is an ultra-small 6mmx6mm land grid array with backside ground.
3.000 0.100
0.800 sq typ 1.700
2.500
NOTE: Nominal thickness, 1.55 mm.
0.600
Optimum Technology Matching(R) Applied
Si BJT Si Bi-CMOS
!
Package Style: LGM (6mmx6mm)
GaAs HBT SiGe HBT
GaAs MESFET Si CMOS
Features * Input/Output Internally Matched @ 50 * Single 3V Supply * 29dBm Linear Output Power * 28dB Linear Gain
VCC1
1
7
GND
RF IN
2
6
RF OUT
* 35% Linear Efficiency
VREG
3
4 VMODE
5
VCC2
Ordering Information
RF3105 RF3105 PCBA 3V 900MHz Linear Amplifier Module Fully Assembled Evaluation Board
Functional Block Diagram
RF Micro Devices, Inc. 7625 Thorndike Road Greensboro, NC 27409, USA
Tel (336) 664 1233 Fax (336) 664 0454 http://www.rfmd.com
Rev A1 001030
2-253
RF3105
Absolute Maximum Ratings Parameter
Supply Voltage (RF off) Supply Voltage (POUT 31dBm) Control Voltage (VREG)
Preliminary
Rating
+8.0 +4.5 +4.2 +10 +3.5 -30 to +85 -30 to +150
Unit
VDC VDC VDC dBm VDC C C Caution! ESD sensitive device.
RF Micro Devices believes the furnished information is correct and accurate at the time of this printing. However, RF Micro Devices reserves the right to make changes to its products without notice. RF Micro Devices does not assume responsibility for the use of the described product(s).
2
POWER AMPLIFIERS
Input RF Power Mode Voltage (VMODE) Operating Ambient Temperature Storage Temperature
Parameter
Overall
Frequency Range Linear Gain Second Harmonic Third Harmonic Maximum Linear Output Power (CDMA Modulation) Total Linear Efficiency Adjacent Channel Power Rejection Input VSWR Output VSWR Noise Figure Noise Power
Specification Min. Typ. Max.
Unit
Condition
T=25C Ambient, VCC =3.4V, VREG =2.75V, VMODE =0, Freq=824MHz to 849MHz unless otherwise specified
824 27
29
849 32.5 -30 -40
28 32
29 35 -44 -58 <2:1 -56 10:1 6:1 8 -89
MHz dB dBc dBc dBm % dBc dBc
ACPR @ 885kHz ACPR @1980kHz No damage. No oscillations.
dB dBm/30kHz MHz dBc dBc dBm % dB
At 45MHz offset.
FM Mode
Frequency Range Second Harmonic Third Harmonic Max CW Output Power Total Efficiency (AMPS) Large Signal Gain Input VSWR Output VSWR 824 849 -30 -40 32
31.5 45 27 <2:1 10:1 6:1 3.2 3.4 100
VCC =3.4V, POUT =31.5dBm
No damage. No oscillations. 4.5 8 40 10 0.2 2.85 V mA mA s A V V
Power Supply
Power Supply Voltage Quiescent Current VREG Current Turn On/Off time Total Current (Power down) VREG "Low" Voltage VREG "High" Voltage
Pin 3, VREG =2.75V VREG =Low
2.65
0 2.75
2-254
Rev A1 001030
Preliminary
Pin 1 2 3 4 5 6 7 Pkg Base Function VCC1 RF IN VREG VMODE VCC2 RF OUT GND GND Description
First stage collector supply. A low frequency decoupling capacitor (e.g., 4.7F) is required. RF input internally matched to 50. This input is internally AC coupled. Regulated voltage supply for amplifier bias. For nominal operation, VMODE is set to LOW. When set HIGH: VMODE will increase the bias current by approximately 50%; and, large signal gain is increased by approximately 1.5dB. Output stage collector supply. A low frequency decoupling capacitor (e.g., 4.7F) is required. RF output internally matched to 50. This output is internally AC coupled. Ground connection. Connect to package base ground. For best performance, keep traces physically short and connect immediately to ground plane. Ground connection. The backside of the package should be soldered to a top side ground pad which is connected to the ground plane with multiple vias. The pad should have a short thermal path to the ground plane.
RF3105
Interface Schematic
2
POWER AMPLIFIERS
Rev A1 001030
2-255
RF3105
Evaluation Board Schematic
(Download Bill of Materials from www.rfmd.com.)
Er = 4.7 H = 14 mils t = 1 mil
Preliminary
2
POWER AMPLIFIERS
VCC1
C1 4.7 F 1 7
J1 RF IN
50 strip 2 6
50 strip
J2 RF OUT
VREG C3 4.7 F
3
3105400-
4
5 C2 4.7 F
VMODE
VCC2
VCC = 3.4 V VREG = 2.75 V VMODE = 0
2-256
Rev A1 001030
Preliminary
Evaluation Board Layout Board Size 2.0" x 2.0"
Board Thickness 0.028", Board Material FR-4, Multi-Layer
Assembly Top
RF3105
2
POWER AMPLIFIERS
Inner 1
Back
Rev A1 001030
2-257
RF3105
Preliminary
2
POWER AMPLIFIERS
2-258
Rev A1 001030


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